RRP Electronics indicators MoU with Deca Applied sciences to amass wafer-level chip packaging functionality 

Semiconductor agency RRP Electronics Ltd. has entered right into a MoU with U.S.-based Deca Applied sciences, Inc. to amass the latter’s wafer-level packaging capabilities. “This partnership marks a big milestone in India’s journey to changing into a worldwide semiconductor powerhouse,” RRP Electronics mentioned.

Beneath the MoU, RRP Electronics, which has experience in assembling and testing semiconductor elements, will combine Deca’s Wafer-Stage Chip Scale Packaging (WLCSP) and M-Collection Fan-Out Wafer-Stage Packaging (FOWLP) applied sciences into its processes. It will improve RRP’s capability to ship high-performance semiconductor options to clients worldwide, it mentioned. Deca Applied sciences is backed by Qualcomm, Infineon, and ASE Group.

Rajendra Okay. Chodankar, Chairman & CEO, RRP Electronics mentioned, “We’re investing in a large-scale Know-how Switch License Settlement (TTLA) with Deca, doubtlessly on unique phrases, to create a totally automated, world-class infrastructure.” “This partnership will take semiconductor packaging in India to new heights. We intention to finish our qualification checks by August 2025 and foresee income exceeding $30 million (about ₹260 crore) in simply the second yr of operations, with exponential progress within the years to come back,” he mentioned. RRP would make an funding of $150 million on this mission.

Tim Olson, Founder & CEO, Deca Applied sciences mentioned, “RRP Electronics’ imaginative and prescient, experience, and willpower make them the proper companion to drive innovation in semiconductor packaging. This collaboration will speed up their bold plans and strengthen India’s place within the world semiconductor worth chain.”